Media Note Office of the Spokesman Washington, DC June 26, 2003
United States Signs Science and Technology Cooperation Agreement With PakistanThe United States of America and the Islamic Republic of Pakistan signed an Agreement on Science and Technology Cooperation Wednesday, June 25, 2003, at 7:30 PM during the inauguration ceremony for the new Pakistan Chancery in Washington, D.C.
President Musharraf hosted the occasion during his visit to the United States. The Science and Technology Cooperation Agreement establishes a legal framework to facilitate broad, bilateral cooperation in science, technology, engineering and education for peaceful purposes between public and private entities from the U.S. and Pakistani scientific communities. The signing of this agreement and the Trade and Investment Framework Agreement (TIFA), which was also signed at the Embassy inauguration, are tangible results of the strengthened U.S.-Pakistan relationship.
Under Secretary of State for Global Affairs Paula Dobriansky signed the agreement on behalf of the United States and Foreign Secretary Riaz Khokhar signed on behalf of the Islamic Republic of Pakistan. Administrator of the United States Agency for International Development Andrew S. Natsios emphasized the importance of science and technology cooperation to the well-being and advancement of both countries in concluding remarks of the ceremony.
It is appropriate that this agreement was signed during President Musharraf’s second visit to Washington during the Bush Administration since both presidents agreed to increase cooperation in science, technology and education during their first meeting in February 2002. This agreement will facilitate U.S. and Pakistani partnerships among government agencies, universities, public and private research centers, and members of the private sector. USAID has provided two million dollars to initiate support for activities undertaken through this agreement. U.S. and Pakistani agencies have already begun to explore possible cooperative activities under this Agreement.
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